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Chip test
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"Chip test"
Development of 121 pins/mm2 High Density Probe Card using Micro-spring Architecture
J Korean Inst Electr Electron Mater Eng
2007;20(9):749-755.
Published online September 1, 2007
DOI:
https://doi.org/10.4313/JKEM.2007.20.9.749
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Citations to this article as recorded by
Optimization of Thermal Deformation in Probe Card
Yong-Hoon Chang, Jeong-Je Yin, Yong-S. Suh
Journal of the Korea Academia-Industrial cooperation Society.2010; 11(11): 4121.
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