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"Coefficient of friction"

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"Coefficient of friction"

Regular Paper : Surface Properties of Re-Ir Coating Thin Film on Tungsten Carbide Surface
Ho Shik Lee, Min Woo Cheon, Yong Pil Park
J Korean Inst Electr Electron Mater Eng 2011;24(3):219-223.   Published online March 1, 2011
DOI: https://doi.org/10.4313/JKEM.2011.24.3.219
Rhenium-Iridium(Re-Ir) thin films were deposited onto the tungsten carbide(WC) molding core by sputtering system. The Re-Ir films were prepared by multi-target sputtering with iridium, rhenium and chromium as the sources. Argon and nitrogen were inlet into the chamber to be the plasma and reactive gases. The Re-Ir thin films were prepared with targets having atomic percent of 3:7 and the Re-Ir thin films were formed with 240 nm thickness. The Re-Ir thin films on tungsten carbide molding core were analyzed by scanning electron microscope(SEM) and surface roughness. Also, adhesion strength and coefficient friction of Re-Ir thin film were examined. The Re-Ir coating technique has been intensive efforts in the field of coating process because the coating technique and process have been their feature, like hardness, high elasticity, abrasion resistance and mechanical stability and also have been applied widely the industrial and biomedical areas. In this report, tungsten carbide(WC) molding core was manufactures using high performance precision machining and the efforts of Re-Ir coating on the surface roughness.
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Characteristics of Friction Affecting CMP Results
J Korean Inst Electr Electron Mater Eng 2004;17(10):1041-1048.   Published online October 1, 2004
DOI: https://doi.org/10.4313/JKEM.2004.17.10.1041

Citations

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  • Material Removal Mechanism of CMP Pad by CVD Conditioner Cutting Edges
    Jiho Shin, Jongmin Jeong, Yeongil Shin, Haedo Jeong
    Journal of the Korean Society for Precision Engineering.2026; 43(7): 671.     CrossRef
  • Effect of pad’s surface deformation and oscillation on monocrystalline silicon wafer surface quality
    Woong-Kirl Choi, Seong-Hyun Kim, Seung-Geon Choi, Eun-Sang Lee, Chul-Hee Lee
    International Journal of Precision Engineering and Manufacturing.2014; 15(11): 2301.     CrossRef
  • Evaluation of the wafer polishing pad capacity and lifetime in the machining of reliable elevations
    Eun-Sang Lee, Ji-Wan Cha, Seong-Hyun Kim
    International Journal of Machine Tools and Manufacture.2013; 66: 82.     CrossRef
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