Skip to main navigation Skip to main content
  • KIEEME

J Electr Electron Mater : Journal of Electrical and Electronic Materials

OPEN ACCESS
ABOUT
BROWSE ARTICLES
EDITORIAL POLICIES
FOR CONTRIBUTORS

Page Path

5
results for

"Conductive adhesive"

Keywords

Publication year

Authors

"Conductive adhesive"

Eco-Friendly Electrically Conductive Adhesives: Silver Optimization for High Performance and Sustainability
Eunae Jo, Chaehwan Jeong
J Electr Electron Mater 2025;38(3):319-323.   Published online May 1, 2025
DOI: https://doi.org/10.4313/JKEM.2025.38.3.12
The growing demand for miniaturized, lightweight, and sustainable electronic devices has intensified the need for advanced bonding materials. Existing electrically conductive adhesives (ECAs) often rely on high silver (Ag) content, resulting in elevated costs and environmental concerns. This study successfully developed a novel ECA with significantly reduced Ag content without compromising essential electrical conductivity and adhesion performance. Experimental results revealed that the optimized ECA demonstrates electrical conductivity comparable to that of commercial products, with notable advantages in cost reduction and eco-friendliness. These advancements position the developed ECA as a promising solution for next-generation electronic manufacturing, contributing to low-carbon technologies and sustainable practices. Future applications could further broaden its use across diverse electronic systems, driving progress in environmentally conscious technologies.
  • 17 View
  • 0 Download
Study on Shingled String Interconnection for High Power Solar Module
Juhwi Kim, Junghoon Kim, Chaehwan Jeong, Wonyoung Choi, Jaehyeong Lee
J Electr Electron Mater 2021;34(6):449-453.   Published online November 1, 2021
DOI: https://doi.org/10.4313/JKEM.2021.34.6.8
Interest and investment in renewable energy have increased worldwide, highlighting the need for renewable energy. Solar energy was the most promising energy of all renewable energy sources, and it has the highest investment value. Because photovoltaics require a certain amount of area for installation, high density and high output performance are required. Shingled module is a promising technology in that they are featured by higher density and higher output compared to the conventional modules. Shingled technology uses a laser scribing to divide solar cells that are to be bonded with electrically conductive adhesive (ECA) to produce and connect strings, which has a higher output in the same area than the conventional modules. In the process of producing solar modules, metal ribbons are used to interconnect cells, but they are also needed for string connections in shingled solar cells. Accordingly, in this study, we researched the interconnection that best suits the connector that joins the string to the string. The module outputs produced under the conditions of the string interconnection were compared and analyzed.
  • 7 View
  • 0 Download
Simulation of Shingled String Characteristics Depending on Cell Strips Type for High Power Photovoltaic Modules
Ji Su Park, Won Je Oh, Jae Hyeong Lee
J Electr Electron Mater 2020;33(1):10-15.   Published online January 1, 2020
DOI: https://doi.org/10.4313/JKEM.2021.33.1.3
Recently, with the increase in the use of urban solar power, solar modules are required to produce high power in limited areas. In this report, we proposed the fabrication of a high-power photovoltaic module using shingles technology, and developed accurate string characteristic simulations based on circuit modeling. By comparing the resistance components between the interconnected cells and the cell strips, the ECA resistance was determined to be 0.003 Ω. Based on the equivalent circuit of the modeled shingled string, string simulation was performed according to the type of cell strip. As a result, it was determined that the cell efficiency of the 4-cell strip was the highest at 19.66%, but the efficiency of the string simulated with the 6-cell strip was the highest at 20.48% in the string unit.
  • 8 View
  • 0 Download
Thermocompression Anisothropic Conductive Films(ACFs) bonding for Flat Panel Displays(FPDs) Application
Jin Suk Pak, Il Jea Jo, Young Eui Shin
J Electr Electron Mater 2009;22(3):199-204.   Published online March 1, 2009
  • 9 View
  • 0 Download
Electric and Mechanical Properties of CMC+PTFE Binary Binder Electrode for Electric Double Layer Capacitor
J Electr Electron Mater 2004;17(10):1079-1084.   Published online October 1, 2004
  • 9 View
  • 0 Download