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"Dark current"

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"Dark current"

Effect of Porous SiC Film Thickness on the Performance of UV Photodetectors Fabricated by Aerosol Deposition
Sabin Hwang, Kwangyeol An, Jihyun Kim, Jin-woo Choi, Minseok Kim, Geonhee Lee, Jong-min Oh, Sang-mo Koo
J Electr Electron Mater 2025;38(6):690-695.   Published online November 1, 2025
DOI: https://doi.org/10.4313/JEEM.2025.38.6.13
Silicon carbide (SiC), with its wide bandgap and strong resistance to radiation and thermal conditions, is a promising material for ultraviolet (UV) photodetector applications under harsh environments. In this study, porous SiC thin films with thicknesses of 20, 50, and 80 nm were fabricated on 4H-SiC substrates using aerosol deposition (AD), which enables roomtemperature film formation. The device with a 50 nm-thick film exhibited the highest photoresponse under UV-C illumination (260 nm), achieving a maximum photo-to-dark current ratio (PDCR) of 205.2, a responsivity of 0.058 A/W, an external quantum efficiency (EQE) of 27.71%, and a specific detectivity (D*) of 7.9×1011 Jones. These results are attributed to an optimized balance between photon absorption and carrier transport in the porous structure. The findings confirm the potential of ADfabricated porous SiC films for highly sensitive and scalable UV photodetector applications.
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Metal-Semiconductor-Metal Photodetector Fabricated on Thin Polysilicon Film
Jae-sung Lee, Kyeong-keun Choi
J Korean Inst Electr Electron Mater Eng 2017;30(5):276-283.   Published online May 1, 2017
DOI: https://doi.org/10.4313/JKEM.2017.30.5.276
A polysilicon-based metal-semiconductor-metal (MSM) photodetector was fabricated by means of our new methods. Its photoresponse characteristics were analyzed to see if it could be applied to a sensor system. The processes on which this study focused were an alloy-annealing process to form metal-polysilicon contacts, a post-annealing process for better light absorption of as-deposited polysilicon, and a passivation process for lowering defect density in polysilicon. When the alloy annealing was achieved at about 400℃, metal-polysilicon Schottky contacts sustained a stable potential barrier, decreasing the dark current. For better surface morphology of polysilicon, rapid thermal annealing (RTA) or furnace annealing at around 900℃ was suitable as a post-annealing process, because it supplied polysilicon layers with a smoother surface and a proper grain size for photon absorption. For the passivation of defects in polysilicon, hydrogen-ion implantation was chosen, because it is easy to implant hydrogen into the polysilicon. MSM photodetectors based on the suggested processes showed a higher sensitivity for photocurrent detection and a stable Schottky contact barrier to lower the dark current and are therefore applicable to sensor systems.
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Measurement of Vacuum Pressure by Electron Emission from Carbon Nanotube Emitters
J Korean Inst Electr Electron Mater Eng 2005;18(5):396-400.   Published online May 1, 2005
DOI: https://doi.org/10.4313/JKEM.2005.18.5.396
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