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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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"Estimation"

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"Estimation"

Performance Estimation Based on 4D Lookup Table Interpolating and Unit Cell Discharge Tests for Thermal Battery
Byeong June Park, Ji Youn Kim, Sang Hyeon Ha, Jang Hyeon Cho
J Electr Electron Mater 2017;30(6):393-400.   Published online June 1, 2017
For comparison to the Li-ion battery, evaluating a thermal battery must consider additional variables. The first one is the temperature difference between the battery and its unit cell. Thermal batteries and their unit cells have a temperature difference that is caused by the thermal battery activation mechanism and its shape. The second variable is the electrochemical reaction steps. Most Li-ion batteries have a constant electrochemical reaction at the electrode, and battery voltage is affected when the concentration of Li ions is changed. However, a thermal battery has several steps in its electrochemical reaction, and each step has a different potential. In this study, we used unit cell discharge tests based on interpolating a 4D lookup table to estimate the performance of a thermal battery. From the test results, we derived an estimation algorithm by interpolating the table, which is queried from specified profile groups. As a result, we found less than a 5 percent difference between estimation and experiment at the 1.3 V cut-off time.
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Insulation Life Estimation for Magnet Wire Under Inverter Surge and Temperature Stress
Jae-jun Park
J Electr Electron Mater 2016;29(10):641-646.   Published online October 1, 2016
Coil specimen was prepared by coating a copper wire with two varnish thin layers: the first was polyamideimide (PAI)/nanosilica (5 wt%) varnish and the second was anti-corona PAI/nanosilica (15 wt%) varnish. Insulation breakdown voltage was investigated under inverter surge condition at 20℃, 70℃, 100℃, 150℃, 200℃, 250℃, respectively. The insulation lifetime of the two layered coil was tens of times longer than that of original PAI coil. And the insulation lifetime decreased with increasing ambient temperature because there was weak binding strength between copper and varnish layer.
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