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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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"FCCL"

Regular Paper : Design and Fabrication of Micro Patterns on Flexible Copper Clad Laminate (FCCL) Using Imprinting Process
Chul Hong Min, Tae Seon Kim
J Electr Electron Mater 2015;28(12):771-775.   Published online December 1, 2015
In this paper, we designed and fabricated low cost imprinting process for micro patterning on FCCL (flexible copper clad laminate). Compared to conventional imprinting process, developed fabrication method processing imprint and UV photolithography step simultaneously and it does not require resin etch process and it can also reduce the fabrication cost and processing time. Based on proposed method, patterns with 10 ㎛ linewidth are fabricated on 180 ㎜ × 180 ㎜ FCCL. Compared to conventional methods using LDI (laser direct imaging) equipment that showed minimum line with 10 ∼ 20 ㎛, proposed method shows comparable pattern resolution with very competitive price and shorter processing time. In terms of mass production, it can be applied to fabrication of large-area low cost applications including FPCB.
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