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"Lubrication"

Characteristics of Friction Affecting CMP Results
J Korean Inst Electr Electron Mater Eng 2004;17(10):1041-1048.   Published online October 1, 2004
DOI: https://doi.org/10.4313/JKEM.2004.17.10.1041

Citations

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  • Material Removal Mechanism of CMP Pad by CVD Conditioner Cutting Edges
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    International Journal of Machine Tools and Manufacture.2013; 66: 82.     CrossRef
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