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"Printed circuit board"

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"Printed circuit board"

Development of Three-Dimensional Deformable Flexible Printed Circuit Boards Using Ag Flake-Based Conductors and Thermoplastic Polyamide Substrates
Aram Lee, Minji Kang, Do Young Kim, Hee Yoon Jang, Ji-won Park, Tae-wook Kim, Jae-min Hong, Seoung-ki Lee
J Electr Electron Mater 2024;37(4):420-426.   Published online July 1, 2024
DOI: https://doi.org/10.4313/JKEM.2024.37.4.9
This study proposes an innovative methodology for developing flexible printed circuit boards (FPCBs) capable of conforming to three-dimensional shapes, meeting the increasing demand for electronic circuits in diverse and complex product designs. By integrating a traditional flat plate-based fabrication process with a subsequent three-dimensional thermal deformation technique, we have successfully demonstrated an FPCB that maintains stable electrical characteristics despite significant shape deformations. Using a modified polyimide substrate along with Ag flake-based conductive ink, we identified optimized process variables that enable substrate thermal deformation at lower temperatures (~130℃) and enhance the stretchability of the conductive ink (ε ~30%). The application of this novel FPCB in a prototype 3D-shaped sensor device, incorporating photosensors and temperature sensors, illustrates its potential for creating multifunctional, shape-adaptable electronic devices. The sensor can detect external light sources and measure ambient temperature, demonstrating stable operation even after transitioning from a planar to a three-dimensional configuration. This research lays the foundation for next-generation FPCBs that can be seamlessly integrated into various products, ushering in a new era of electronic device design and functionality.
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Energy Materials : Design and Fabrication of Printed Circuit Board (PCB) Integrated Energy Harvester
Chul Hong Min, Tae Seon Kim
J Electr Electron Mater 2013;26(11):846-851.   Published online November 1, 2013
Recently, energy harvesting technologies are considered as the great alternatives to reduce the dependency on secondary batteries. In this paper, we proposed PCB type energy harvester which can be directly integrated with other electronic components on same board. To form the three dimensional coil structure, two PCBs with patterned metal lines are solder bonded. For magnetic induction, inside of coil structure was filled with magnetic substance and rotary motioned external magnets are applied to near the harvester. The effects of metal wire width on PCB, thickness of magnetic substance, and frequency of rotary motion on energy harvesting performance are analyzed by computer simulation and experiments. Experimental results showed 29.89 ㎼ of power generation performance at the frequency of 5.2 Hz and it is shown that designed harvester can be effectively applied on vibration environment with very limited frequency.
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Characteristics of BMN Thin Films Deposited on Various Substrates for Embedded Capacitor Applications
J Electr Electron Mater 2007;20(4):342-347.   Published online April 1, 2007
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