DSSC (dye-sensitized solar cell) is expected to be one of the next-generation photovoltaics because of its environment-friendly and low-cost properties. However, commercialization of DSSC is difficult because of the electrolyte leakage. We propose thermal curable base on silicon resin and apply a unit cell and large area (200×200 mm) dye-sensitized solar cell. The resin aimed at sealing of DSSC and gives a promising resolution for sealing of practical DSSC. In result, the photoelectric conversion efficiency of the unit cell and the module was 6.63% and 5.49%, respectively. In the durability test result, the photoelectric conversion efficiency of the module during 500, 1,000, 1,500 and 2,000 hours was 0.73%, 0.73%, 1.82% and 2.36% respectively. It was confirmed that the photoelectric conversion efficiency characteristics are constant. We have developed encapsulation material of thermal curing method excellent in chemical resistance. A sealing material was applied to the dye-sensitized solar cell and it solved the problem of durability the dye-sensitized solar cell. Sealing material may be applied to verify the possibility of practical application of the dye-sensitized solar cell.

In this study, the effect of vanadium oxide (V₂O₅) content and pre-sintering atmosphere on sealing property of glass frit that consisted of V₂O₅-BaO-ZnO-P₂O₅-TeO₂-CuO-Fe₂O₃ SeO₂ was investigated by XPS (X-ray photoelectron spectroscopy). The content of V₂O₅ was changed to 15, 30, and 45 mol%, and the pre-sintering was carried out in air and N₂ condition, respectively. XPS analysis conducted before and after laser irradiation with identical sample. Before laser treatment, glass frits that were pre-sintered at air condition showed both V₄₊and V₅₊, but the valence state was changed to V₅₊ after laser irradiation when the glass frits contained 30 and 45 mol% V₂O₅; this change led to non-adhesive property. On the other hand, glass frits that were pre-sintered at N₂ condition exhibited only V₄₊ and it showed fine adhesion irrespective of the V₂O₅ content. As a result, the existence of V₄₊ seems to be a major factor for controlling the adhesive property of glass frit for laser sealing.

One of the important issues for fabricating the microelectronic display devices such as FED, PDP, and VFD is to obtain a high vacuum level inside the panel. In addition, sustaining the initial high vacuum level permanently is also very important. In the conventional packing technology using a tabulation method, it is not possible to obtain a satisfiable vacuum level for a proper operation. In case of FED, the poor vacuum level results in the increase of operating voltage for electron emission from field emitter tips and an arcing problem, resultantly shortening a life time. Furthermore, the reduction of a sealing process time in the PDP production is veryimportant in respect of commercial product. The most probable method for obtaining the initial high vacuum level inside the space with such a miniature and complex geometry is a vacuum in-line sealing which seals two glass plates within a high vacuum chamber. The critical solution for the vacuum sealing is to develop a frit glass to avoid the bubbling or crack problems during the sealing process at high temperature of about 400℃ under the vacuum environment. In this study, the suitable frit power was developed using a mixture of vitreous and crystalline type frit powders, and a vacuum sealed CNT FED with 2 inch diagonal size was fabricated and successfully operated.

In this study, we developed a lead-free P_{2}`O_{5}`-V_{2}O_{5}-ZnO glass frit for sealing OLED using laser irradiation. The frit satisfied the characteristics required for laser sealing such as low glass transition temperature, low coefficient of thermal expansion (CTE), high water-resistance, and high absorption at the wavelength of the laser beam. Ceramic fillers were added to the glass frit in order to further reduce and match its CTE with that of the commercial glass substrate. The addition of Zirconium Tungsten Phosphate (ZWP) to the frit yielded the most desirable results, reducing the CTE to 45.4×10^{-7}/℃, which is very close to that of the glass substrate (44.0×10^{-7}/℃). Successful formation of a solid sealing layer was observed by optical and scanning electron microscopy.