The potential of replacing crosslinked polyethylene (XLPE) with an eco-friendly alternative, polypropylene (PP), as insulating material is investigated for overhead power distribution lines. Although XLPE exhibits excellent electrical and mechanical properties, the byproducts generated during crosslinking pose environmental challenges. PP is a viable alternative because of recyclability and absence of byproducts during crosslinking. This study evaluated alternating current (AC) breakdown strength, contact angle, and tracking resistance of two commercially available XLPE samples and three types of PP (PP1, PP2, PP3) with varying additive content. AC breakdown strength, analyzed using the Weibull distribution, facilitated relative comparison of insulation performance. PP2 exhibited scale parameters comparable to or exceeding those of XLPE. Contact angles exceeding 90° displayed hydrophobicity across all samples. To address pass/fail evaluation limitations, arcing images from tracking tests were analyzed using the box-counting method for fractal dimension analysis. Fractal dimensions increased with arcing extent, and complexity increased with test duration. Tracking resistance performance order was PP3, PP1, CC, PP2, OC which was attributed to enhanced heat dissipation properties of filler additives. The proposed quantitative method for comparing tracking resistance through fractal dimension analysis, explored the feasibility of using PP insulating materials in overhead power distribution lines.

Breakdown strength is an essential parameter for evaluating the electrical performance and degradation behavior of cable insulation and IEC 60243 also emphasizes its importance for detecting changes in insulation characteristics due to aging. However, the current IEC standards are mainly limited to specifying electrode configurations and test voltage conditions for breakdown tests, while the influence of insulating oil, is not clearly addressed. In this study, the breakdown strength of a 66 kV wet-type submarine cable was experimentally evaluated using insulating oils with different kinematic viscosities of 10, 100, 500, and 1,000 cSt in order to achieve reliable and reproducible breakdown measurements. The experimental results show that the measured breakdown strength decreases by up to approximately 20% depending on the oil viscosity. This indicates that the viscosity of the insulating oil has a significant influence on the measured breakdown strength during breakdown test. Therefore, it is necessary to perform breakdown strength measurements under identical test conditions, including the physical properties of the insulating oil, to ensure reliable comparison and accurate assessment of insulation performance and degradation characteristics.

This study investigates the insulation performance of a 66 kV dry-type submarine cable used in offshore wind farms under mechanical aging. During installation and operation, submarine cables are subjected to various mechanical stresses, including tension, compression, and bending, which can lead to insulation deterioration. In this study, XLPE samples extracted from a submarine cable were prepared and subjected to controlled tensile strain below the yield strain to evaluate their mechanical and electrical performance. Changes in tensile strength, elongation, and tan δ (dielectric loss factor) were measured to assess the extent of aging. The results indicate that as the applied strain and exposure duration increased, tensile strength and elongation decreased, while tan δ values increased, signifying a decline in electrical insulation performance. A strong negative correlation (R = -0.809) was observed between tan δ and tensile strength, demonstrating that mechanical aging significantly affects electrical properties. These findings highlight the importance of minimizing excessive mechanical stress during the installation and operation of submarine cables. The results provide valuable insights for enhancing the reliability of submarine cables in offshore wind farms and emphasize the necessity of optimized design and maintenance strategies to mitigate the effects of mechanical aging.

We have studied the effects of Ag on the characteristics of Sn₄₈In₅₂Ag_x (wt%) low-melting solders for photovoltaic ribbons. The Sn₄₈In₅₂ (wt%) solder coexisted in the InSn₄ and In₃Sn alloys. Ag atoms added in the solder formed an AgIn₂ alloy by reacting with some part of In atoms, while they did not react with Sn atoms. The addition of Ag atoms in the Sn₄₈In52Agx (wt%) solders showed useful results; an increase in peel strength and a decrease in melting temperature. The peel strength of the ribbon plated with the Sn⁴⁸In⁵² (wt%) solder was 53.6 N/mm², and that of the Sn⁴⁸In⁵²Ag1 (wt%) solder largely increased to 125.1 N/mm². In the meanwhile, the melting temperature of the Sn₄₈In⁵² (wt%) solder was 119.2℃, and that of the Sn48In52Ag1 (wt%) solder decreased to 114.0℃.

Multilayered actuators using Pb(Mg_1/3Nb_2/3)O₃-Pb(In_1/2Nb_1/2)O₃-PbTiO₃ (PMN-PIN-PT) crystals have demonstrated excellent properties, but are costly and lack mechanical strength. Textured PMN-PIN-PT ceramics exhibit robust mechanical strength and comparable properties to their single crystals form. However, the development of multilayered actuators using textured PMN-PIN-PT ceramics has not been achieved until now. This study presents the development of a multilayered actuator using textured 0.37PMN-0.29PIN-0.34PT ceramics with an Ag0.9/Pd0.1 inner electrode, co-fired at 950℃. A random 0.37PMN- 0.29PIN-0.34PT ceramics multilayered actuator was also developed for comparison. The multilayered actuator consisted of 9 ceramic layers (36 μm thickness) with an overall actuator thickness of 0.401 mm. The textured and random 0.37PMN-0.29PIN- 0.34PT ceramics-based multilayered actuators achieved displacements of 0.61 μm (0.15% strain) and 0.23 μm (0.057% strain) at a low applied peak voltage of 100 V. These results suggest that the developed multilayered actuator using high-performance textured 0.37PMN-0.29PIN-0.34PT ceramics has the potential to replace expensive single crystal-based actuators costeffectively.

We studied the various characteristics of Sn-In (wt%) Pb-free solders for photovoltaic ribbon application. The solders near the eutectic composition of Sn₄₈In₅₂ (wt%) existed in InSn₄ and In₃Sn alloy phases, and in In crystal phase, but not in Sn crystal phase. In addition, the InSn4 phase (γ-alloy) existed separately from the In₃Sn (β-alloy) and the In phase confirmed by an SEM-EDS-mapping. The melting temperature of the eutectic solder of Sn₄₈In₅₂ (wt%) was 119.2℃, and when the Sn content decreased in reference to the eutectic composition, it slightly increased to 121.4℃, but when the Sn content increased, it remained almost constant at 119.1℃. The peel strength of the ribbon plated with the Sn₄₂In₅₈ (wt%) solder was 38.7 N/㎟, and it tended to increase when the Sn content increased. The peel strength of the eutectic Sn₄₈In₅₂ (wt%) solder was 53.6 N/㎟, and that of the Sn₅₁In₄₉ (wt%) solder was 61.6 N/㎟ that was the highest.

This study performs the thermal aging of chlorosulfonated polyethylene (CSPE) for 807.36 and 1,614.48 hours at 110℃, which is equivalent to 40 and 80 years of aging at 50℃ in nuclear power plants, respectively. Flat-type CSPEs were soaked in seawater for five days and then dried for five days at room temperature. Furthermore, the soaked CSPEs were cleaned for 5 days with fresh water and dried for 1,100 days at room temperature. Through this process, the log IV of the CSPEs decreases, whereas the dissipation factor of the CSPEs increases as thermally accelerated aged years increase at the measured frequency. Although the phase degree of the response voltage versus excitation voltage of the CSPEs increases, that of the response current versus excitation voltage decreases with the thermally accelerated aging. The thermal conductivity of the CSPEs increases slightly, but the thermal diffusivity does not vary with the thermally accelerated aged year increase. The displacement of the compressive strength of the CSPEs decreases gradually as the thermally accelerated aged years increase.

Recently, macroporous ceramic materials with high electrical conductivity and mechanical strength are urgently needed for semiconductor and display manufacturing devices. In this work, we obtained electro-conducting macroporous aluminosilicate ceramics having surface resistivity of 108~1,010 ohm by dispersing electro-conducting carbon in ceramic matrix. By addition of 0.5~3.0 wt% frit glass, chemical bonding between grains was strengthened, and flexural strength was enhanced up to 160 MPa as a result. We evaluated the characteristics of present ceramics as vacuum chuck module for liquid crystal display display manufacturing devices.

We have studied the effects of Ag on the characteristics of Sn₄₃Bi₅₇Ag_x(wt%) lead-free solders for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of Ag₃Sn after reacting with some part of Sn atoms, while they did not react with Bi atoms, but decreased the mean size of Bi solid phase and the thickness of solder. When Ag atoms of 3.0 wt% was added to eutectic Sn₄₃Bi₅₇(wt%) solder, it showed the optimally useful results that the peel strength of photovoltaic ribbon greatly increased and the sheet resistance of the solder decreased. In the meanwhile, the eutectic Sn₄₃Bi₅₇(wt%) solder showed a low melting temperature of 138.9℃, and showed a very similar result regardless of the added amount of Ag atoms.

In order to develop an electrical insulation material for gas GIS (insulation switch gear) spacer, 4 types of epoxy/micro-alumina (40, 50, 60, 70 wt%) composites and 9 types of epoxy/nano-alumina (1, 3, 5 g)/micro-alumina (40, 50, 60, 70 wt%) composites were prepared and tensile test was carried out. In here, nano-alumina was previously surface-treated with GDE (glycerol diglycidyl ether). As micro-alumina and GDE-treated nano-alumina contents increased, tensile strength increased and the highest value was shown in the system with 3 g GDE-treated nano-alumina.

Molded insulation materials are widely used from large electric power transformer apparatus to small electrical machinery and apparatus. In this study, by adding MgO with the average particle of several tens nm and the excellent thermal conductivity into molding material, we improved the problem of insulation breakdown strength decrease according to rising temperature in overload or in bad environmental condition. We confirmed the life evaluation by using the insulation breakdown and inverse involution to investigate the electrical characteristics of nano-composites materials. By using a scanning electron microscope, it is confirmed that MgO power with the average particle size of several tens nm is distributed and the filler particles is uniformly distributed in the cross section of specimens. And it is confirmed that the insulation breakdown strength of Virgin specimens is rapidly decreased at the high temperature area. But it is confirmed that the insulation breakdown strength of specimens added MgO slow decreased by thermal properties in the high temperature area improved by the contribution of the heat radiation of MgO and the suppression of tree. The results of life prediction using inverse involution, it is confirmed that the life of nano-composites is improved by contribution of MgO according to the predicted insulation breakdown strength after 10 years of specimens added 5.0 wt% of MgO is increased about 2.9 times at RT, and 4.9 times at 100 than Virgin specimen, respectively.

We have studied the effects of Ag on the characteristics of Sn60Pb40Agx (wt%) solder for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of Ag3Sn after reacting with some part of Sn atoms, while they did not react with Pb atoms, but decreased the mean size of Pb solid phase. The enhancement of peel strength between solar cell and ribbon is an important part in the developments of long-lifespan solar module. The peel strength of the solder ribbon of Sn60Pb40 (wt%) was 169 N/mm2, and it was largely enhanced by adding a small amount of Ag atoms. The maximum peel strength was 295 N/mm2 in the solder ribbon of Sn60Pb40Ag2 (wt%). This result is caused by the high binding energy of 162.9 kJ/mol between Ag atoms in the solder and Ag atoms in Ag sheet.

In this study, some materials are organized and experimented with variables to obtain the optimum mix proportion for the mechanical property of halogen free flame resistance compound with varying addition of nano clay. Tensile strength, density and stiffness are tested in the room temperature. In this study, unlike existing layered structure, nano clay with tabular structure is used and sufficient stiffness, strength, thermal stability and gas block capability can be achieved with small amount of addition. Tensile strength and elongation test show high rupture strength only in specimens with compatibilizing agents while density test shows average measurement in all the specimens except T-9. It was confirmed that the measurement value according to the additives in compatibilizing agent or in nano clay of hardness test represents similarly.

In order to develop a high voltage insulation material, spherical silicas with two average particle sizes of 5 μm and 20 μm were mixed in different mixing ratios (1:0, 0.7:0.3, 0.5:0.5, 0.3:0.7, 0:1) and their total filling content was fixed at 65 wt%. In order to observe the dispersion of the spherical silicas and the interfacial morphology between silica and epoxy matrix, field emission scanning electron microscope (FE-SEM) was used. The electrical insulation breakdown strength was estimated in sphere-plate electrodes with different insulation thicknesses of 1, 2, and 3 mm. Electrical insulation breakdown strength decreased with increasing mixing ratio of 5/20 μm and the thickness dependence of the breakdown strength was also observed. The tensile strength of the neat epoxy was 82.8 MPa as average value and its increased with decreasing particles size and that of epoxy/silica (2 μm) was 107 MPa, which was 130.8% higher value.

Reported here are results of the mechanical and electrical properties of both of intact and thermally degraded epoxy-coated copper busducts that are made by fluidized bed process. To elucidate and compare the properties mentioned above, electrical breakdown by thermal and water aging, v-t characteristic, bending test, impact test and cross cut test are carried out. Although the performance of electrical and mechanical properties are gradually decreased in increasing the severe conditions such as temperature, aging time, and so forth, sample C has a better performance in both mechanical and electrical properties.

According to the composition of LTCC material, though it was thought that bulk defect which was made in forming process effects on the densification during the sintering, it was not reported systemically. In this study, we evaluated crystal structure, 3 point bending strength, hardness and microstructure of the samples by uniaxial pressing and tape casting using the commercial powders of the crystallizing glass and the glass/ceramic composite. In the case of glass/ceramic composite, Viox-001 powder with residual glass in the sintering, 3 point bending strength was similar regardless of forming process due to fill the bulk defect by residual glass. In the case of crystallizing glass, MLS-22, because glass phase was small in the sintering, glass did not fill the pore in the sample by uniaxial pressing process, therefore, the 3 point bending strength of it was 167 MPa. However, the 3 point bending strength of the sample by tape casting was 352 MPa and much higher. Meanwhile, crystal structure and hardness were similar regardless of forming process.

The properties of LTCC green sheets formed by the MLS-22 powder of NEG Inc. were investigated for acrylic binders with different PVB and Tg in the variation of temperature. The elongation of the green sheets showed large variation depending on the temperature, and was rapidly decreased near the Tg of the sheets. With the increase of the ratio of plasticizer/binder (P/B), large elongation of the sheets was observed due to the decrease of the Tg. In the stacking process of the multilayer ceramic, the optimal control of the temperature is highly required depending on the Tg of the binder and the ratio of P/Buniform coating.

In order to develop electrical insulation materials, epoxy-nanosilica-microsilica mixture composites (ENMC) was synthesized, and mechanical properties such as their tensile and flexural strength, and AC insulation breakdown strength were investigated. Properties of mechanical strength and AC insulation breakdown strength are analyzed as scale and shape parameter with respect to weibull plot. Their tensile and flexural strength, AC insulation breakdown strength were compared original epoxy or EMC to ENMC. The 4 phr nano-silica addition and the 65 wt% micron-silica mixture composite (ENMC) was found to have the highest tensile and flexural strength. In the tensile strength was improved 29%, and flexural strength was improved 60.9% higher than those of the original epoxy. In the insulation breakdown strength, ENMC_4 phr was improved 17% and ENMC_5 phr was improved 15.8% higher than those of the EMC.

In this study, the characteristics and error ranges of the mechanical bonding strength were analyzed according to before and after thermal shock test for various chips of automotive application component using Sn-3.0Ag-0.5Cu solder. In the after thermal shock test, the mechanical bonding strengths tend to decrease, meanwhile decreasing rates of mechanical strengths were less then 12% at specimen`s bonding area below 3.5mm2, and were from 17 to 21% at specimen`s bonding area above 12 mm2. On the other hand, Specimen`s mean deviation rates were about 5% at specimen`s bonding area more than 12 mm2. Inversely, at specimen`s bonding area is less then 3.5 mm2, mean deviation rates were increased to about 8%. It means that the smaller device size is, the larger mean deviation rate. In addition, error ranges and deviation rates of the mechanical bonding strengths may differ slightly depending on their bonding area. Furthermore, process conditions as well as method of mechanical reliability evaluation should be established to reduce the error ranges of bonding strength.

Abstract: This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.