For the semiconductor device safety from over current in the digital electronic circuit systemmust be surely designed that it`s surface mount type micro fuse device. In this paper, We has analysedto the fusing character of micro fuse as a function changed thickness of thermosetting ink epoxy. To thechange of thermosetting ink epoxy thickness with in production lot, in the electrically character (fusingtest in the 2 multiple over current and 10 multiple over current, surface temperature test in the 1.25multiple over current) of micro fuse has been tested. According to the electrically character result,changed thickness of thermosetting ink epoxy in designed micro fuse withheld direct effect in both endresistance changes. Also, because high thermal energy in the micro fuse test of over current wasoccurred to effect such as thermal runaway and explosion. Therefore, screen printing process in thedesign of micro fuse using thermosetting ink epoxy is very important for production quality improvement.