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Semicondactor : Fabrication of Wafer Level Fine Pitch Solder Bump for Flip Chip Application

Chul Won Ju, Sung Jun Kim, Kyu Ha Pack, Hee Tae Lee, Byung Sung Han, Seong Su Park, Young Il Kang
J Electr Electron Mater 2001;14(11):874-878.
Published online: November 1, 2001
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Semicondactor : Fabrication of Wafer Level Fine Pitch Solder Bump for Flip Chip Application
J Electr Electron Mater. 2001;14(11):874-878.   Published online November 1, 2001
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Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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Semicondactor : Fabrication of Wafer Level Fine Pitch Solder Bump for Flip Chip Application
J Electr Electron Mater. 2001;14(11):874-878.   Published online November 1, 2001
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