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실리카 슬러리의 희석과 연마제의 첨가가 CMP 특성에 미치는 영향

박창준, 김상용, 서용진

Effects of Diluted Silica Slurry and Abresives on the CMP Characteristics

Chang Jun Park, Sang Yong Kim, Yong Jin Seo
J Electr Electron Mater 2002;15(10):851-857.
Published online: October 1, 2002
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Effects of Diluted Silica Slurry and Abresives on the CMP Characteristics
J Electr Electron Mater. 2002;15(10):851-857.   Published online October 1, 2002
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Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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Effects of Diluted Silica Slurry and Abresives on the CMP Characteristics
J Electr Electron Mater. 2002;15(10):851-857.   Published online October 1, 2002
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