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열처리 방법에 따른 실리콘 기판쌍의 접합 특성

민홍석, 이상현, 송오성, 주영창

Bonding Property of Silicon Wafer Pairs with Annealing Method

Hong Seok Min, Sang Hyun Lee, Oh Sung Song, Young Chang Joo
J Korean Inst Electr Electron Mater Eng 2003;16(5):365-371.
Published online: May 1, 2003
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Bonding Property of Silicon Wafer Pairs with Annealing Method
J Korean Inst Electr Electron Mater Eng. 2003;16(5):365-371.   Published online May 1, 2003
DOI: https://doi.org/10.4313/JKEM.2003.16.5.365
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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Bonding Property of Silicon Wafer Pairs with Annealing Method
J Korean Inst Electr Electron Mater Eng. 2003;16(5):365-371.   Published online May 1, 2003
DOI: https://doi.org/10.4313/JKEM.2003.16.5.365
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