Application of Herd Porous Pad in Metal CMP Process

Sang Yong Kim; Nam Hoon Kim; In Pyo Kim; Eui Goo Chang

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금속 CMP 공정시 경질 다공성 패드의 적용

김상용, 김남훈, 김인표, 장의구

Application of Herd Porous Pad in Metal CMP Process

Sang Yong Kim, Nam Hoon Kim, In Pyo Kim, Eui Goo Chang

J Electr Electron Mater 2003;16(5):385-389.
Published online: May 1, 2003

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Keywords: Polishing Pad, Metal CMP, Pad Life Time, Cost Reduction, Slurry Usage, Cycle Time

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Application of Herd Porous Pad in Metal CMP Process

J Electr Electron Mater. 2003;16(5):385-389. Published online May 1, 2003

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Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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Application of Herd Porous Pad in Metal CMP Process

J Electr Electron Mater. 2003;16(5):385-389. Published online May 1, 2003

Articles

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금속 CMP 공정시 경질 다공성 패드의 적용

Application of Herd Porous Pad in Metal CMP Process

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