Skip to main navigation Skip to main content
  • KIEEME

J Electr Electron Mater : Journal of Electrical and Electronic Materials

OPEN ACCESS
Search
Advanced Search
ABOUT
BROWSE ARTICLES
EDITORIAL POLICIES
FOR CONTRIBUTORS

Articles

Page Path

금속 CMP 공정시 경질 다공성 패드의 적용

김상용, 김남훈, 김인표, 장의구

Application of Herd Porous Pad in Metal CMP Process

Sang Yong Kim, Nam Hoon Kim, In Pyo Kim, Eui Goo Chang
J Korean Inst Electr Electron Mater Eng 2003;16(5):385-389.
Published online: May 1, 2003
  • 47 Views
  • 0 Download
  • 0 Crossref
  • 0 Scopus
prev next

Full Article

Download PDF Download PDF

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

Include:

Application of Herd Porous Pad in Metal CMP Process
J Korean Inst Electr Electron Mater Eng. 2003;16(5):385-389.   Published online May 1, 2003
DOI: https://doi.org/10.4313/JKEM.2003.16.5.385
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
Format:
Include:
Application of Herd Porous Pad in Metal CMP Process
J Korean Inst Electr Electron Mater Eng. 2003;16(5):385-389.   Published online May 1, 2003
DOI: https://doi.org/10.4313/JKEM.2003.16.5.385
Close

Related articles

ABOUT

BROWSE ARTICLES

EDITORIAL POLICIES

FOR CONTRIBUTORS

© The Korean Institute of Electrical and Electronic Materials Engineers.