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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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기타 : 벗김강도 측정법에 의한 파워 모듈의 솔더접합 특성 평가

김남균, 이희홍, 방욱, 서길수, 김은동

Other : Characterization of the Soldering Interface in Power Modules by Peel Strength Measurement

Nam Gyun Kim, Hui Hong Lee, Ug Bang, Gil Su Seo, Eun Dong Kim
J Electr Electron Mater 2003;16(12):1142-1149.
Published online: December 1, 2003
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Other : Characterization of the Soldering Interface in Power Modules by Peel Strength Measurement
J Electr Electron Mater. 2003;16(12):1142-1149.   Published online December 1, 2003
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Other : Characterization of the Soldering Interface in Power Modules by Peel Strength Measurement
J Electr Electron Mater. 2003;16(12):1142-1149.   Published online December 1, 2003
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