Skip to main navigation Skip to main content
  • KIEEME

J Electr Electron Mater : Journal of Electrical and Electronic Materials

OPEN ACCESS
ABOUT
BROWSE ARTICLES
EDITORIAL POLICIES
FOR CONTRIBUTORS

Articles

CMP 연마입자의 마찰력과 연마율에 관한 영향

김구연, 김형재, 박범영, 이현섭, 박기현, 정해도

Effect of Abrasive Particles on Frictional Force and Abrasion in Chemical Mechanical Polishing(CMP)

, , , , ,
J Electr Electron Mater 2004;17(10):1049-1055.
Published online: October 1, 2004
  • 4 Views
  • 0 Download
  • 0 Crossref
  • 0 Scopus
prev next

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

Include:

Effect of Abrasive Particles on Frictional Force and Abrasion in Chemical Mechanical Polishing(CMP)
J Electr Electron Mater. 2004;17(10):1049-1055.   Published online October 1, 2004
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Effect of Abrasive Particles on Frictional Force and Abrasion in Chemical Mechanical Polishing(CMP)
J Electr Electron Mater. 2004;17(10):1049-1055.   Published online October 1, 2004
Close