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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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혼합 산화제를 사용한 텅스텐 막의 전기화학적 부식 및 CMP 특성

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Electrochemical Corrosion and Chemical Mechanical Polishing(CMP) Characteristics of Tungsten Film using Mixed Oxidizer

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J Electr Electron Mater 2005;18(4):303-308.
Published online: April 1, 2005
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Electrochemical Corrosion and Chemical Mechanical Polishing(CMP) Characteristics of Tungsten Film using Mixed Oxidizer
J Electr Electron Mater. 2005;18(4):303-308.   Published online April 1, 2005
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Electrochemical Corrosion and Chemical Mechanical Polishing(CMP) Characteristics of Tungsten Film using Mixed Oxidizer
J Electr Electron Mater. 2005;18(4):303-308.   Published online April 1, 2005
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