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실리콘 연마에서 패드 버핑 공정이 연마특성에 미치는 영향

박기현, 정해도, 박재홍, 마사하루키노시타

Effect of Pad Buffing process on Material Removal Characteristics in Silicon Chemical Mechanical Polishing

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J Electr Electron Mater 2007;20(4):303-307.
Published online: April 1, 2007
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Effect of Pad Buffing process on Material Removal Characteristics in Silicon Chemical Mechanical Polishing
J Electr Electron Mater. 2007;20(4):303-307.   Published online April 1, 2007
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Effect of Pad Buffing process on Material Removal Characteristics in Silicon Chemical Mechanical Polishing
J Electr Electron Mater. 2007;20(4):303-307.   Published online April 1, 2007
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