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열초음파 접합 공정과 접합부의 신뢰성 평가에 관한 연구

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A Study on Thermosonic Bonding Process and Its Reliability Evaluation of Joints

Young Eui Shin, Jin Suk Park, Sun Eik Son
J Electr Electron Mater 2009;22(8):625-631.
Published online: August 1, 2009
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A Study on Thermosonic Bonding Process and Its Reliability Evaluation of Joints
J Electr Electron Mater. 2009;22(8):625-631.   Published online August 1, 2009
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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A Study on Thermosonic Bonding Process and Its Reliability Evaluation of Joints
J Electr Electron Mater. 2009;22(8):625-631.   Published online August 1, 2009
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