Skip to main navigation Skip to main content
  • KIEEME

J Electr Electron Mater : Journal of Electrical and Electronic Materials

OPEN ACCESS
ABOUT
BROWSE ARTICLES
EDITORIAL POLICIES
FOR CONTRIBUTORS

Articles

절연재료 : 전력전자용 금속증착 필름 커패시터 설계 및 신뢰성 평가

윤중락, 김영광, 이석원, 이헌용

Insulation Materials : The Design and Reliability Evaluation of Metallized Film Capacitor for Power Electronic Applications

Jung Rag Yoon, Young Kwang Kim, Serk Won Lee, Heun Young Lee
J Electr Electron Mater 2011;24(5):381-386.
Published online: May 1, 2011
  • 5 Views
  • 0 Download
  • 0 Crossref
  • 0 Scopus
prev next

This paper presents the design and reliability evaluation of metallized film capacitor for power electronics application. The rated voltage of development capacitor is DC 3300[V], the capacitance is 5 μF and the ripple current capability is 130 A(rms). Film metallization and patterns are an important design factor that has been development enhance the electric and reliability properties of film capacitor for power electro nics. In term of capacitor construction and metallized pattern is one of the parameters that can be modified to further improve the rating in the terms of maximum ripple current and lifetime. This capacitor can be used as snubber capacitor application such as power train invertor system.

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

Include:

Insulation Materials : The Design and Reliability Evaluation of Metallized Film Capacitor for Power Electronic Applications
J Electr Electron Mater. 2011;24(5):381-386.   Published online May 1, 2011
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Insulation Materials : The Design and Reliability Evaluation of Metallized Film Capacitor for Power Electronic Applications
J Electr Electron Mater. 2011;24(5):381-386.   Published online May 1, 2011
Close