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진공펌프 조합에 의한 반도체공정 진공시스템 진공특성 전산모사

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Simulation of Vacuum Characteristics in Semiconductor Processing Vacuum System by the Combination of Vacuum Pumps

Hyung Taek Kim, Dae Yeon Kim
J Electr Electron Mater 2011;24(6):449-457.
Published online: June 1, 2011
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Effect of pump combinations on the vacuum characteristics of vacuum system was simulate d for optimum design of system. In this investigation, the feasibility of modelling mechanism for VacSim(Multi) simulator was proposed. Simulation results of various pumping combinations showed the possibilities and reliabilities of simulation for the performance of vacuum system in specific semiconductor processing. Simulation of roughing pump presented the expected pumping behaviors based on commercial specifications of employed pumps. Application of booster pump exhibited the high pumping efficiency for middle vacuum range. Combinations of optimum backing pump for diffusion and turbo vacuum system were obtained. And, the predictable characteristics of process application of both simulated systems were also acquired.

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Simulation of Vacuum Characteristics in Semiconductor Processing Vacuum System by the Combination of Vacuum Pumps
J Electr Electron Mater. 2011;24(6):449-457.   Published online June 1, 2011
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Simulation of Vacuum Characteristics in Semiconductor Processing Vacuum System by the Combination of Vacuum Pumps
J Electr Electron Mater. 2011;24(6):449-457.   Published online June 1, 2011
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