Abstract: To study the encapsulation method for heat dissipation of high brightness organic light emitting diode (OLEI)), red emitting OLED of ITO (150 nm) / 2 TNATA (50 rim) / NPB (30 rim) / A1q3 1 vol.% Rubrene (30 nm) / Alq3 (30 nm) / LiF (0.7 nm) / Al (200 nm) structure was fabricated, which on Alq3 (150 nm) / LiF (ISo nm) as buffer layer and Al as protective layer was deposited to protect the damage of OLED, and subsequently it was encapsulated using attaching film and metal sheet. The current density, luminance and power efficiency was improved according to thickness of Al protective layer. The emission spectrum and the Commission International de L`Eclairage (CIE) coordinate did not have any effects on encapsulation process using attaching film and metal sheet The lifetime of encapsulated OLED using attaching film and metal sheet was 307 hours in 1,200 nm Al thickness, which was increased according to thickness of Al protective layer, and was improved 7% compared with 287 hours, lifetime of encapsulated OLEI) using attaching film and flat glass. As a result, it showed the improved current density, luminance, power efficiency and the long lifetime, because the encapsulation method using attaching film and metal sheet could radiate the heat on OLED effectively.
