Spinel thin films were prepared by the spin spray technique to develop new thermal imaging materials annealed at low temperature for uncooled microbolometer applications. The spinel thin films were deposited from [(Ni0.30Co0.33Mn0.37)1-xCux]3O4 (0.1≤x≤0.2) solutions and then annealed at 400℃ for 1 h inargon. Effects of Cu content (x) and deposition time on the electrical properties of the annealed films were investigated. With increasing deposition time, the resistivity of the annealed films increased. For the annealed films deposited for 1 min, the resistivity of x=0.15 films was lower than that of x=0.1 films due to the different grain sizes. The high temperature coefficient of resistance (TCR) of the annealed films could be obtained at temperature below 50℃. Typically, the resistivity of 127 Ω·cm and TCR of -5.69%/Kat 30℃ were obtained for x=0.1 films with deposition time of 1 min annealed at 400℃ for 1 h in argon.
