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MOCVD에 의한 Al 박막 증착 중의 표면 반사도 측정을 통한 박막 성장 메커니즘 분석

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Regular Paper : Analysis of Growth Mechanism of Al Thin Film by in-situ Surface Reflectance Measurement During MOCVD Process

Ki Soo Kim, Moon Kyu Seo
J Electr Electron Mater 2015;28(2):104-108.
Published online: February 1, 2015
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Al thin films were deposited on TiN/Si(100) via metal-organic chemical vapor deposition using N-methylpyrrolidine alane as a precursor. Characterization of the deposited films were investigated with SEM, XRD, α-step, AFM, 4-point probe. The early stage of Al thin film deposition was analyzed by in-situ surface reflectance measurement with laser and photometer apparatus. The surface reflectance were changed greatly during the initial 30∼40 seconds. There were two increases and two decreases in the surface reflectance, thus the sequence of Al films were deposited at 8 significant points of the surface reflectance change. Surface topograph and cross-sectional view of each film were analyzed with SEM. Al films were grown in the complex mechanism of Volmer-Weber and Stranski-Krastanov process.

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Regular Paper : Analysis of Growth Mechanism of Al Thin Film by in-situ Surface Reflectance Measurement During MOCVD Process
J Electr Electron Mater. 2015;28(2):104-108.   Published online February 1, 2015
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Regular Paper : Analysis of Growth Mechanism of Al Thin Film by in-situ Surface Reflectance Measurement During MOCVD Process
J Electr Electron Mater. 2015;28(2):104-108.   Published online February 1, 2015
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