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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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열전도성 고분자와 Al재질의 Heat Sink 방열 성능 비교 분석

최두호, 최원호, 조주웅, 박대희

Regular Paper : Comparative Analysis of Thermal Dissipation Properties to Heat Sink of Thermal Conductive Polymer and Aluminum Material

Doo Ho Choi, Won Ho Choi, Ju Ung Jo, Dae Hee Park
J Electr Electron Mater 2015;28(2):137-141.
Published online: February 1, 2015
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The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was 7.6℃ higher while lowest temperature was 7.8℃ lower. The test on the heat sinks made by the materials, highest temperature was 4.1℃ higher and lowest temperature was 3.9℃ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.

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Regular Paper : Comparative Analysis of Thermal Dissipation Properties to Heat Sink of Thermal Conductive Polymer and Aluminum Material
J Electr Electron Mater. 2015;28(2):137-141.   Published online February 1, 2015
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Regular Paper : Comparative Analysis of Thermal Dissipation Properties to Heat Sink of Thermal Conductive Polymer and Aluminum Material
J Electr Electron Mater. 2015;28(2):137-141.   Published online February 1, 2015
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