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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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레일 체결구 결함 검측 모듈의 방열성능 개선을 위한 열 해석

채원규, 박영, 권삼영, 이재형

Regular Paper : Thermal Analysis for Improvement of Heat Dissipation Performance of the Rail Anchoring Failure Detection Module

Won Kyu Chae, Young Park, Sam Young Kwan, Jae Hyeong Lee
J Electr Electron Mater 2016;29(2):125-130.
Published online: February 1, 2016
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In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by 25℃ when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below 55℃ when the optimal heat dissipation design was applied.

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Regular Paper : Thermal Analysis for Improvement of Heat Dissipation Performance of the Rail Anchoring Failure Detection Module
J Electr Electron Mater. 2016;29(2):125-130.   Published online February 1, 2016
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Regular Paper : Thermal Analysis for Improvement of Heat Dissipation Performance of the Rail Anchoring Failure Detection Module
J Electr Electron Mater. 2016;29(2):125-130.   Published online February 1, 2016
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