Injection molding is used in many industrial fields such as home appliances, vehicle parts, and electronic device parts because various resins can be molded, leading to mass production of complex shapes. Generally, the empirical prediction method is used to set the initial processing conditions of injection molding. However, this approach requires a lot of cost and its presented solution is not accurate. In this paper, injection molding was simulated through the MoldflowTM in order to manufacture the spacer for gas insulated switch. Through the simulation, the flow of the resin with respect to the diameter of the inlet was analyzed. It was found that the process was possible at a higher resin temperature as the diameter of the inlet increased. In addition, through thermal analysis during injection of the resin, it was confirmed that a stagnation phenomenon occurred at the insert portion during injection molding, and the temperature of the resin was higher than that of the mold. As in this paper, if the spacer is manufactured by optimizing the injection hole and the temperature of the injection process based on simulation, it is expected that the spacer can be manufactured with high productivity.
