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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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다중 공정변수를 활용한 저비용 PUF 보안 Chip의 제작

지홍석, 손돌, 연주원, 길태현, 박효준, 윤의철, 이문권, 박준영

Fabrication of Low-Cost Physically Unclonable Function (PUF) Chip Using Multiple Process Variables

Hong-seock Jee, Dol Sohn, Ju-won Yeon, Tae-hyun Kil, Hyo-jun Park, Eui-cheol Yun, Moon-kwon Lee, Jun-young Park
J Electr Electron Mater 2024;37(5):527-532.
Published online: September 1, 2024
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Physically Unclonable Functions (PUFs) provide a high level of security for private keys using unique physical characteristics of hardware. However, fabricating PUF chips requires numerous semiconductor processes, leading to high costs, which limits their applications. In this work, we introduce a low-cost manufacturing method for PUF security chips. First, surface roughening through wet-etching is utilized to create random variables. Additionally, physical vapor deposition is added to further enhance randomness. After PUF chip fabrication, both Hamming distance (HD) and Hamming weight (HW) are extracted and compared to verify the fabricated chip. It is confirmed that the PUF chip using two different multiple process variables demonstrates superior uniqueness and uniformity compared to the PUF security chip fabricated using only a single process variable.

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Fabrication of Low-Cost Physically Unclonable Function (PUF) Chip Using Multiple Process Variables
J Electr Electron Mater. 2024;37(5):527-532.   Published online September 1, 2024
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
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Fabrication of Low-Cost Physically Unclonable Function (PUF) Chip Using Multiple Process Variables
J Electr Electron Mater. 2024;37(5):527-532.   Published online September 1, 2024
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