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반도체 봉지수지의 파괴 인성치 측정 및 패키지 적용

김경섭, 신영의, 장의구

Fracture Toughness Measurement of the Semiconductor Encapsulant EMC and It's Application to Package

Kyung Soeb Kim, Young Eui Shin, Eui Goo Chang
J Electr Electron Mater 1997;10(6):519-527.
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Fracture Toughness Measurement of the Semiconductor Encapsulant EMC and It's Application to Package
J Electr Electron Mater. 1997;10(6):519-527.
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Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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Fracture Toughness Measurement of the Semiconductor Encapsulant EMC and It's Application to Package
J Electr Electron Mater. 1997;10(6):519-527.
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