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IC 몰딩 콤파운드 재료의 파괴 인성치 (Ⅱ)

김경섭, 신영의

Fracture Toughness of IC Molding Compound Materials (Ⅱ)

Kyung Seob Kim, Young Eui Shin
J Electr Electron Mater 1998;11(5):353-357.
Published online: May 1, 1998
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Fracture Toughness of IC Molding Compound Materials (Ⅱ)
J Electr Electron Mater. 1998;11(5):353-357.   Published online May 1, 1998
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Fracture Toughness of IC Molding Compound Materials (Ⅱ)
J Electr Electron Mater. 1998;11(5):353-357.   Published online May 1, 1998
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