Study on the Bonding Pad Lift Failure in Wire Bonding

Kyung Seob Kim; Eui Goo Chang; Young Eui Shin

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와이어 본딩시 본딩 패드 리프트 불량에 관한 연구

김경섭, 장의구, 신영의

Study on the Bonding Pad Lift Failure in Wire Bonding

Kyung Seob Kim, Eui Goo Chang, Young Eui Shin

J Electr Electron Mater 1998;11(12):1079-1083.
Published online: December 1, 1998

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Study on the Bonding Pad Lift Failure in Wire Bonding

J Electr Electron Mater. 1998;11(12):1079-1083. Published online December 1, 1998

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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bib — For JabRef, BibDesk, and other BibTeX-specific software

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Study on the Bonding Pad Lift Failure in Wire Bonding

J Electr Electron Mater. 1998;11(12):1079-1083. Published online December 1, 1998

A Study on the Optimal Generation Conditions of Micro-Droplet in Electrostatic Spray Indirect Charging Method

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와이어 본딩시 본딩 패드 리프트 불량에 관한 연구

Study on the Bonding Pad Lift Failure in Wire Bonding

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