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"Ag paste bump"

Characterization of Electrical Resistance for SABiT Technology-Applied PCB: Dependence of Bump Size and Fabrication Condition
Chul Ho Song, Young Hun Kim, Sang Min Lee, Jee Soo Mok, Yong Suk Yang
J Electr Electron Mater 2010;23(4):298-302.   Published online April 1, 2010
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