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"Alternating motion"

ITO Wet Etch Properties in an In-Line Wet Etch,Cleaning System by using an Alternating Movement of Substrate
Sung Jae Hong, Sang Jik Kwon, Eou Sik Cho
J Korean Inst Electr Electron Mater Eng 2008;21(8):715-718.   Published online August 1, 2008
DOI: https://doi.org/10.4313/JKEM.2008.21.8.715
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