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Filp chip package
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Jin Suk Park (1)
Young Eui Shin (1)
Sun Eik Son (1)
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"Filp chip package"
A Study on Thermosonic Bonding Process and Its Reliability Evaluation of Joints
Young Eui Shin, Jin Suk Park, Sun Eik Son
J Electr Electron Mater
2009;22(8):625-631.
Published online August 1, 2009
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