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IMC
WHERE t1.sid in(parameter_dbtbl_keyword '%IMC%') and t1.xml_status <> 99
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"IMC"
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IMC (2)
ENIG (1)
Intermetilic compound (1)
Lead-free Solder (1)
LF solder (1)
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2010 (1)
2003 (1)
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Cheol Ho Heo (1)
Sung Jin Hwang (1)
Gi Ho Jeong (1)
Min Ju Kim (1)
Jin Ho Kong (1)
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Keywords
IMC (2)
ENIG (1)
Intermetilic compound (1)
Lead-free Solder (1)
LF solder (1)
P-rich Layer (1)
Solder joint reliability (1)
Solderability (1)
Wetting balance test (1)
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Cheol Ho Heo (1)
Sung Jin Hwang (1)
Gi Ho Jeong (1)
Min Ju Kim (1)
Jin Ho Kong (1)
Dae Yool Ok (1)
Chang Sik Park (1)
Young Eui Shin (1)
An Seob Shin (1)
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2003 (1)
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"IMC"
Nano Materials and Devices : A Study of Properties of Sn-3Ag-0.5Cu Solder Based on Phosphorous Content of Electroless Ni-P Layer
An Seob Shin, Dae Yool Ok, Gi Ho Jeong, Min Ju Kim, Chang Sik Park, Jin Ho Kong, Cheol Ho Heo
J Electr Electron Mater
2010;23(6):481-486.
Published online June 1, 2010
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Other : Characterization of the Sn-Ag-Cu and Sn-Cu Lead-free Solder by adding P
Young Eui Shin, Sung Jin Hwang
J Electr Electron Mater
2003;16(6):549-554.
Published online June 1, 2003
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