Skip to main navigation
Skip to main content
KIEEME
mobile search button
mobile menu button
Search
Advanced Search
ABOUT
ABOUT
Journal introduction
Aims and scope
Editorial board
Management team
Best practice
Subscription information
Contact us
BROWSE ARTICLES
All issues
Current issue
Most viewed
Most downloaded
Most cited
Search
Metrics
EDITORIAL POLICIES
Research ethics
Peer review policy
Copyright and open access policy
Article sharing policy
Archiving policy
Data sharing policy
Preprint policy
Crossmark policy
Advertising and sponsorship policy
Research misconduct-related regulations
FOR CONTRIBUTORS
Instructions for authors
Checklist
Copyright transfer agreement
Graphical abstract
E-SUBMISSION
ABOUT
Journal introduction
Aims and scope
Editorial board
Management team
Best practice
Subscription information
Contact us
BROWSE ARTICLES
All issues
Current issue
Most viewed
Most downloaded
Most cited
Search
Metrics
EDITORIAL POLICIES
Research ethics
Peer review policy
Copyright and open access policy
Article sharing policy
Archiving policy
Data sharing policy
Preprint policy
Crossmark policy
Advertising and sponsorship policy
Research misconduct-related regulations
FOR CONTRIBUTORS
Instructions for authors
Checklist
Copyright transfer agreement
Graphical abstract
Page Path
HOME
Search
IMC
WHERE t1.sid in(parameter_dbtbl_keyword '%IMC%') and t1.xml_status <> 99
2
results for
"IMC"
Filter
Keywords
IMC (2)
ENIG (1)
Intermetilic compound (1)
Lead-free Solder (1)
LF solder (1)
More +
Publication year
2010 (1)
2003 (1)
Authors
Cheol Ho Heo (1)
Sung Jin Hwang (1)
Gi Ho Jeong (1)
Min Ju Kim (1)
Jin Ho Kong (1)
More +
Keywords
IMC (2)
ENIG (1)
Intermetilic compound (1)
Lead-free Solder (1)
LF solder (1)
P-rich Layer (1)
Solder joint reliability (1)
Solderability (1)
Wetting balance test (1)
Cancel
Close
authors
Cheol Ho Heo (1)
Sung Jin Hwang (1)
Gi Ho Jeong (1)
Min Ju Kim (1)
Jin Ho Kong (1)
Dae Yool Ok (1)
Chang Sik Park (1)
Young Eui Shin (1)
An Seob Shin (1)
Cancel
Close
Publication Year
2010 (1)
2003 (1)
Cancel
Close
Funded articles
Cancel
Close
"IMC"
Nano Materials and Devices : A Study of Properties of Sn-3Ag-0.5Cu Solder Based on Phosphorous Content of Electroless Ni-P Layer
An Seob Shin, Dae Yool Ok, Gi Ho Jeong, Min Ju Kim, Chang Sik Park, Jin Ho Kong, Cheol Ho Heo
J Korean Inst Electr Electron Mater Eng
2010;23(6):481-486.
Published online June 1, 2010
DOI:
https://doi.org/10.4313/JKEM.2010.23.6.481
PDF
32
View
0
Download
Other : Characterization of the Sn-Ag-Cu and Sn-Cu Lead-free Solder by adding P
Young Eui Shin, Sung Jin Hwang
J Korean Inst Electr Electron Mater Eng
2003;16(6):549-554.
Published online June 1, 2003
DOI:
https://doi.org/10.4313/JKEM.2003.16.6.549
PDF
30
View
0
Download
First
Prev
Page
of 1
Next
Last
×
TOP
First
Prev
