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나노재료 및 소자 : Sn-3Ag-0.5Cu Solder에 대한 무전해 Ni-P층의 P함량에 따른 특성 연구

신안섭, 옥대율, 정기호, 김민주, 박창식, 공진호, 허철호

Nano Materials and Devices : A Study of Properties of Sn-3Ag-0.5Cu Solder Based on Phosphorous Content of Electroless Ni-P Layer

An Seob Shin, Dae Yool Ok, Gi Ho Jeong, Min Ju Kim, Chang Sik Park, Jin Ho Kong, Cheol Ho Heo
J Electr Electron Mater 2010;23(6):481-486.
Published online: June 1, 2010
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Nano Materials and Devices : A Study of Properties of Sn-3Ag-0.5Cu Solder Based on Phosphorous Content of Electroless Ni-P Layer
J Electr Electron Mater. 2010;23(6):481-486.   Published online June 1, 2010
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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Nano Materials and Devices : A Study of Properties of Sn-3Ag-0.5Cu Solder Based on Phosphorous Content of Electroless Ni-P Layer
J Electr Electron Mater. 2010;23(6):481-486.   Published online June 1, 2010
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