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"Min Jeong Kim"

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"Min Jeong Kim"

Review Paper

Academic Progress Report

Enhancing the Sensitivity and Spectral Selectivity of Colloidal Quantum Dot Infrared Photodetectors Using Metasurfaces
Min Jeong Kim, Tae Won Nam
J Electr Electron Mater 2026;39(4):340-352.
Published online July 1, 2026
DOI: https://doi.org/10.4313/JEEM.2026.39.4.3
Quantum dots (QDs) are semiconductor nanocrystals with sizes on the order of several nanometers, whose bandgaps can be tuned by controlling the particle size. Owing to this bandgap tunability, QDs can absorb near-infrared (NIR) and short-wave infrared (SWIR) light, spectral regions that are difficult to access with conventional silicon-based devices. However, colloidal QDbased infrared photodetectors still suffer from intrinsically high dark current, trap-induced noise, and limited response speed. As a result, they exhibit fundamental performance gaps in terms of detectivity and speed–bandwidth product compared to epitaxial infrared detectors, highlighting the need for structural and architectural design strategies to overcome these limitations. In this review, we discuss recent advances in enhancing the spectral selectivity and sensitivity of infrared photodetectors through three-dimensional optical architectures, including metasurfaces and metamaterials. We focus in particular on design strategies and the underlying mechanisms responsible for performance enhancement, and we outline how structural approaches can be leveraged to effectively control the sensitivity and wavelength selectivity of QD-based infrared detectors.
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Regular Paper : The Research of Ni Electroless Plating for Ni/Cu Front Metal Solar Cells
Jae Doo Lee, Min Jeong Kim, Min Jeong Kim, Soo Hong Lee
J Korean Inst Electr Electron Mater Eng 2011;24(4):328-332.   Published online April 1, 2011
DOI: https://doi.org/10.4313/JKEM.2011.24.4.328
The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surface. One of the front metal contacts is Ni/Cu plating that it is available to simply and inexpensive production to apply mass production. Ni is shown to be a suitable barrier to Cu diffusion into the silicon. The process of Ni electroless plating on front silicon surface is performed using a chemical bath. Additives and buffer agents such as ammonium chloride is added to maintain the stability and pH control of the bath. Ni deposition rate is found to vary with temperature, time, utilization of bath. The experimental result shown that Ni layer by SEM (scanning electron microscopy) and EDX analysis. Finally, plated Ni/Cu contact solar cell result in an efficiency of 17.69% on 2×2 cm2, Cz wafer.

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  • Characterization and Selective Properties of Electroless Deposited All Wet Contact Electrode
    Areum Kim, Seon Jea Lee, Eunmi Choi, Sung Gyu Pyo
    Journal of The Electrochemical Society.2014; 161(3): D118.     CrossRef
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Energy Materials : Application of a Selective Emitter Structure for Ni/Cu Plating Metallization Crystalline Silicon Solar Cells
Min Jeong Kim, Jae Doo Lee, Soo Hong Lee
J Korean Inst Electr Electron Mater Eng 2010;23(7):575-579.   Published online July 1, 2010
DOI: https://doi.org/10.4313/JKEM.2010.23.7.575
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Energy Materials : Analysis of the Formation of Rear Contact for Monocrystalline Silicon Solar Cells
Hyuk Yong Kwon, Jae Doo Lee, Min Jeong Kim, Soo Hong Lee
J Korean Inst Electr Electron Mater Eng 2010;23(7):571-574.   Published online July 1, 2010
DOI: https://doi.org/10.4313/JKEM.2010.23.7.571

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  • Size-controlled glass frits with spherical shape for Al electrodes in Si solar cells
    Jang Heui YI, Jung Hyun KIM, You Na KO, Young Jun HONG, Hye Young KOO, Yun Chan KANG, Hye Moon LEE
    Journal of the Ceramic Society of Japan.2011; 119(1396): 954.     CrossRef
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  • 1 Crossref