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Regular Paper

Solvent-Dependent Crystallization and Charge Transport Evolution in Thermally Annealed P3HT:PCBM Bulk Heterojunction Solar Cells
Dong-Kyun Kim, Byungyou Hong, Hyung Jin Kim
J Electr Electron Mater 2026;39(4):400-406.
Published online July 1, 2026
DOI: https://doi.org/10.4313/JEEM.2026.39.4.10
Organic solar cells based on bulk heterojunction (BHJ) structures have attracted considerable attention because of their low fabrication cost, mechanical flexibility, and compatibility with solution-processing techniques. In BHJ organic photovoltaic devices, nanoscale morphology and crystallinity of the photoactive layer critically influence photovoltaic performance. In this study, the effects of solvent selection and thermal annealing on crystallization evolution and photovoltaic characteristics of P3HT:PCBM organic solar cells were systematically investigated. Three different solvents, including toluene, chlorobenzene (CB), and dichlorobenzene (DCB), were employed for active-layer fabrication, followed by post-thermal annealing treatment. UV–visible absorption spectroscopy revealed solvent-dependent differences in molecular ordering and intermolecular π–π interactions within the active layer. X-ray diffraction analysis confirmed that thermal annealing significantly enhanced crystallinity and lamellar ordering of P3HT domains, particularly for CB-processed films. Electrical characterization demonstrated that solvent evaporation behavior strongly affects photovoltaic performance. Among the investigated devices, the thermally annealed CB-processed device exhibited the highest power conversion efficiency of 1.83% with an enhanced short-circuit current density of 7.057 mA cm⁻². The improved device performance is attributed to optimized crystallization behavior and balanced nanoscale phase separation induced by the moderate evaporation characteristics of CB. In contrast, although DCB-assisted films exhibited relatively strong optical absorption and enhanced crystallinity, excessively slow solvent evaporation likely induced excessive aggregation and coarse phase separation, limiting efficient photovoltaic characteristics. These results demonstrate that solvent engineering combined with thermal annealing is an effective strategy for controlling morphology evolution and crystallization behavior in P3HT:PCBM bulk heterojunction solar cells.
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The Efficiency Characteristics of the Ferroelectric Polymer Added Organic Solar-cells
Ja Young Park, Chi Sup Jung
J Korean Inst Electr Electron Mater Eng 2016;29(9):589-594.   Published online September 1, 2016
DOI: https://doi.org/10.4313/JKEM.2016.29.9.589
P3HT:PCBM bulk heterojunction solar cells added with ferroelectric polymer were fabricated and characterized. By incorporating P3HT:PCBM solar cell with P(VDF-TrFE) ferroelectric additive, the power conversion efficiency was increased up to nearly 50%. Photoacoustic analysis on this phenomena was carried out for the first time. Through this study, we find that the ferroelectricity of the polymer additive plays the key role in the enhancement of the power conversion efficiency of the organic solar cell by suppressing the non-radiative recombination of charge transfer exciton more effectively.

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  • Solvent-Dependent Crystallization and Charge Transport Evolution in Thermally Annealed P3HT:PCBM Bulk Heterojunction Solar Cells
    Dong-Kyun Kim, Byungyou Hong, Hyung Jin Kim
    Journal of Electrical and Electronic Materials.2026; 39(4): 400.     CrossRef
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  • 1 Crossref
Regular Paper : Design and Fabrication of Micro Patterns on Flexible Copper Clad Laminate (FCCL) Using Imprinting Process
Chul Hong Min, Tae Seon Kim
J Korean Inst Electr Electron Mater Eng 2015;28(12):771-775.   Published online December 1, 2015
DOI: https://doi.org/10.4313/JKEM.2015.28.12.771
In this paper, we designed and fabricated low cost imprinting process for micro patterning on FCCL (flexible copper clad laminate). Compared to conventional imprinting process, developed fabrication method processing imprint and UV photolithography step simultaneously and it does not require resin etch process and it can also reduce the fabrication cost and processing time. Based on proposed method, patterns with 10 ㎛ linewidth are fabricated on 180 ㎜ × 180 ㎜ FCCL. Compared to conventional methods using LDI (laser direct imaging) equipment that showed minimum line with 10 ∼ 20 ㎛, proposed method shows comparable pattern resolution with very competitive price and shorter processing time. In terms of mass production, it can be applied to fabrication of large-area low cost applications including FPCB.
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Energy Materials : Design and Fabrication of Printed Circuit Board (PCB) Integrated Energy Harvester
Chul Hong Min, Tae Seon Kim
J Korean Inst Electr Electron Mater Eng 2013;26(11):846-851.   Published online November 1, 2013
DOI: https://doi.org/10.4313/JKEM.2013.26.11.846
Recently, energy harvesting technologies are considered as the great alternatives to reduce the dependency on secondary batteries. In this paper, we proposed PCB type energy harvester which can be directly integrated with other electronic components on same board. To form the three dimensional coil structure, two PCBs with patterned metal lines are solder bonded. For magnetic induction, inside of coil structure was filled with magnetic substance and rotary motioned external magnets are applied to near the harvester. The effects of metal wire width on PCB, thickness of magnetic substance, and frequency of rotary motion on energy harvesting performance are analyzed by computer simulation and experiments. Experimental results showed 29.89 ㎼ of power generation performance at the frequency of 5.2 Hz and it is shown that designed harvester can be effectively applied on vibration environment with very limited frequency.
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Regular Paper : Analysis of Thermal Properties in LED Package by Via-hole and Dimension of FR4 PCB
Sung Hyun Kim, Se Il Lee, Jong Kyung Yang, Dae Hee Park
J Korean Inst Electr Electron Mater Eng 2011;24(3):234-239.   Published online March 1, 2011
DOI: https://doi.org/10.4313/JKEM.2011.24.3.234
In this study, the heat transfer capability have been improved by using via-holes in FR4 PCB, when the LED lighting is designed to solve the thermal problem. The thermal resistance and junction temperature were measured by changing the dimension of FR4 PCB and size of via hole. As a result, when the dimension was increased initially, the thermal resistance and junction temperature was decreased rapidly, the ones was stabilized after the dimension of 200 [mm2]. Also, the light output was improved up to maximum 17% by formation of via-hole and expansion of dimension in FR4 PCB. Therefore, the thermal resistance and junction temperature could be improved by expansion of PCB dimension and configuration of via-hole ability.

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  • Reflection Characteristics of Electroplated Deposits on LED Lead frame with Plating Condition
    SeHo Kee, Wonjoong Kim, JaePil Jung
    Journal of the Microelectronics and Packaging Society.2013; 20(2): 29.     CrossRef
  • Anisotropic Wet-Etching Process of Si Substrate for Formation of Thermal Vias in High-Power LED Packages
    B.K. Yu, M.Y. Kim, T.S. Oh
    Journal of the Microelectronics and Packaging Society.2012; 19(4): 51.     CrossRef
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Characteristics of AlN Dielectric Layer for Metal PCB as a Function of Nitrogen Partial Pressure Using RF-Magnetron Sputtering Method
Hwa Min Kim, Jeong Sik Park, Dong Young Kim, Kang Bae, Sun Young Sohn
J Korean Inst Electr Electron Mater Eng 2010;23(10):759-762.   Published online October 1, 2010
DOI: https://doi.org/10.4313/JKEM.2010.23.10.759
In this investigation, the effects of N(2)/(Ar+N(2)) gas partial pressure on the structural, electrical, and thermal properties of AlN dielectric layers prepared on aluminum substrates using RF-magnetron sputtering method were analyzed. Among the films, the AlN dielectric film deposited under N(2)/(Ar+N(2)) gas partial pressure of 75% exhibit the highest AlN (002) preferred orientation, which was grain size of about 15.3(2) nm and very dense structure. We suggest the possibilities of it`s application as a dielectric layer for metal PCB because the AlN films prepared at optimized gas partial pressure can improving the insulating property, the thermal conductivity, and thermal diffusivity of the films.

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  • Characterization of AlN Thin Films Grown by Pulsed Laser Deposition on Sapphire Substrate
    Eun-Hee Jeong, Jun-Ki Chung, Rae-Young Jung, Sung-Jin Kim, Sang-Yeup Park
    Journal of the Korean Ceramic Society.2013; 50(6): 551.     CrossRef
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Characterization of Electrical Resistance for SABiT Technology-Applied PCB: Dependence of Bump Size and Fabrication Condition
Chul Ho Song, Young Hun Kim, Sang Min Lee, Jee Soo Mok, Yong Suk Yang
J Korean Inst Electr Electron Mater Eng 2010;23(4):298-302.   Published online April 1, 2010
DOI: https://doi.org/10.4313/JKEM.2010.23.4.298
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Study on Low Temperature Bonding Technology for Optical PCB with Polymer Intermediate Layers
Doo Yeol Cha, Jai Hyuk Lee, Sung Pil Chang
J Korean Inst Electr Electron Mater Eng 2010;23(1):29-33.   Published online January 1, 2010
DOI: https://doi.org/10.4313/JKEM.2010.23.1.029
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Real-time Chemical Monitoring System using RGB Sensor toward PCB Manufacturing
Jong Hwan An, Seok Jun Lee, Lee Chul Kim, Sang Jeen Hong
J Korean Inst Electr Electron Mater Eng 2008;21(5):397-401.   Published online May 1, 2008
DOI: https://doi.org/10.4313/JKEM.2008.21.5.397
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Improvement of COF Bending-induced Lead Broken Failure in LCD Module
Boum Joo Shim, Yeol Choi, Jun Sin Yi
J Korean Inst Electr Electron Mater Eng 2008;21(3):265-271.   Published online March 1, 2008
DOI: https://doi.org/10.4313/JKEM.2008.21.3.265
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