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"Randomness"

Fabrication of Low-Cost Physically Unclonable Function (PUF) Chip Using Multiple Process Variables
Hong-seock Jee, Dol Sohn, Ju-won Yeon, Tae-hyun Kil, Hyo-jun Park, Eui-cheol Yun, Moon-kwon Lee, Jun-young Park
J Electr Electron Mater 2024;37(5):527-532.   Published online September 1, 2024
DOI: https://doi.org/10.4313/JKEM.2024.37.5.9
Physically Unclonable Functions (PUFs) provide a high level of security for private keys using unique physical characteristics of hardware. However, fabricating PUF chips requires numerous semiconductor processes, leading to high costs, which limits their applications. In this work, we introduce a low-cost manufacturing method for PUF security chips. First, surface roughening through wet-etching is utilized to create random variables. Additionally, physical vapor deposition is added to further enhance randomness. After PUF chip fabrication, both Hamming distance (HD) and Hamming weight (HW) are extracted and compared to verify the fabricated chip. It is confirmed that the PUF chip using two different multiple process variables demonstrates superior uniqueness and uniformity compared to the PUF security chip fabricated using only a single process variable.
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