Skip to main navigation
Skip to main content
KIEEME
mobile search button
mobile menu button
Search
Advanced Search
ABOUT
ABOUT
Journal introduction
Aims and scope
Editorial board
Management team
Best practice
Subscription information
Contact us
BROWSE ARTICLES
All issues
Current issue
Most viewed
Most downloaded
Most cited
Search
Metrics
EDITORIAL POLICIES
Research ethics
Peer review policy
Copyright and open access policy
Article sharing policy
Archiving policy
Data sharing policy
Preprint policy
Crossmark policy
Advertising and sponsorship policy
Research misconduct-related regulations
FOR CONTRIBUTORS
Instructions for authors
Checklist
Copyright transfer agreement
Graphical abstract
E-SUBMISSION
Article Template
ABOUT
Journal introduction
Aims and scope
Editorial board
Management team
Best practice
Subscription information
Contact us
BROWSE ARTICLES
All issues
Current issue
Most viewed
Most downloaded
Most cited
Search
Metrics
EDITORIAL POLICIES
Research ethics
Peer review policy
Copyright and open access policy
Article sharing policy
Archiving policy
Data sharing policy
Preprint policy
Crossmark policy
Advertising and sponsorship policy
Research misconduct-related regulations
FOR CONTRIBUTORS
Instructions for authors
Checklist
Copyright transfer agreement
Graphical abstract
Page Path
HOME
Search
Reused slurry
WHERE t1.sid in(parameter_dbtbl_keyword '%Reused slurry%') and t1.xml_status <> 99
1
results for
"Reused slurry"
Filter
Keywords
Abrasive (1)
chemical mechanical polishing (1)
CMP (1)
Consumables (1)
Removal rate (1)
More +
Publication year
2003 (1)
Authors
Un Sig Choe (1)
Sang Yong Kim (1)
Gyeong Jin Lee (1)
U Seon Lee (1)
Jin Seong Park (1)
More +
Keywords
Abrasive (1)
chemical mechanical polishing (1)
CMP (1)
Consumables (1)
Removal rate (1)
Reused slurry (1)
Cancel
Close
authors
Un Sig Choe (1)
Sang Yong Kim (1)
Gyeong Jin Lee (1)
U Seon Lee (1)
Jin Seong Park (1)
Yong Jin Seo (1)
Cancel
Close
Publication Year
2003 (1)
Cancel
Close
Funded articles
Cancel
Close
"Reused slurry"
Characteristics of 2-Step CMP (Chemical Mechanical Polishing) Process using Reused Slurry by Adding of Silica Abrasives
Yong Jin Seo, Gyeong Jin Lee, Un Sig Choe, Sang Yong Kim, Jin Seong Park, U Seon Lee
J Korean Inst Electr Electron Mater Eng
2003;16(9):759-764.
Published online September 1, 2003
DOI:
https://doi.org/10.4313/JKEM.2003.16.9.759
PDF
65
View
0
Download
First
Prev
Page
of 1
Next
Last
×
TOP
First
Prev
