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실리카 연마제가 첨가된 재활용 슬러리를 사용한 2단계 CMP 특성

서용진, 이경진, 최운식, 김상용, 박진성, 이우선

Characteristics of 2-Step CMP (Chemical Mechanical Polishing) Process using Reused Slurry by Adding of Silica Abrasives

Yong Jin Seo, Gyeong Jin Lee, Un Sig Choe, Sang Yong Kim, Jin Seong Park, U Seon Lee
J Electr Electron Mater 2003;16(9):759-764.
Published online: September 1, 2003
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Characteristics of 2-Step CMP (Chemical Mechanical Polishing) Process using Reused Slurry by Adding of Silica Abrasives
J Electr Electron Mater. 2003;16(9):759-764.   Published online September 1, 2003
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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Characteristics of 2-Step CMP (Chemical Mechanical Polishing) Process using Reused Slurry by Adding of Silica Abrasives
J Electr Electron Mater. 2003;16(9):759-764.   Published online September 1, 2003
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