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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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"Solder interface"

Other : Characterization of the Soldering Interface in Power Modules by Peel Strength Measurement
Nam Gyun Kim, Hui Hong Lee, Ug Bang, Gil Su Seo, Eun Dong Kim
J Electr Electron Mater 2003;16(12):1142-1149.   Published online December 1, 2003
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