This study performs the thermal aging of chlorosulfonated polyethylene (CSPE) for 807.36 and 1,614.48 hours at 110℃, which is equivalent to 40 and 80 years of aging at 50℃ in nuclear power plants, respectively. Flat-type CSPEs were soaked in seawater for five days and then dried for five days at room temperature. Furthermore, the soaked CSPEs were cleaned for 5 days with fresh water and dried for 1,100 days at room temperature. Through this process, the log IV of the CSPEs decreases, whereas the dissipation factor of the CSPEs increases as thermally accelerated aged years increase at the measured frequency. Although the phase degree of the response voltage versus excitation voltage of the CSPEs increases, that of the response current versus excitation voltage decreases with the thermally accelerated aging. The thermal conductivity of the CSPEs increases slightly, but the thermal diffusivity does not vary with the thermally accelerated aged year increase. The displacement of the compressive strength of the CSPEs decreases gradually as the thermally accelerated aged years increase.

Hexagonal boron nitride particles (s-hBN) modified with 3-aminopropyl triethoxysilane (APTES) were used for the preparation of silicone composite materials. The microstructure of the composite materials was observed, and the thermal conduction and mechanical characteristics of the composite sheets were studied based on the compositions and microstructures. When a small amount of s-hBN particles was used, the thermal conductivity of the composite improved as a whole, and the tensile strength of the sheet also increased. The thermal conductivity and tensile strength of the composite in which a small amount of carbon fiber was added along with s-hBN were further improved. However, the use of carbon nanotubes with structural characteristics similar to those of carbon fiber resulted in lower thermal conductivity and tensile strength. Elastic silicone composites exhibiting 2.5 W/mK of thermal conductivity and a low hardness are expected to be used as thermally conductive interfacial sheet materials.

Thermal and electrical conductivities of the natural, artificial, and expandable graphites were analyzed after treatment in NaOH aqueous solution. In order to investigate the elimination of the oxidized groups and impurities on the graphite surfaces after NaOH treatment, the graphite samples were structurally characterized by using XRD, XPS, Raman, FE-SEM. The thermal and electrical conductivities of the graphite samples were significantly improved after NaOH treatment. These results were caused by the structural rehabiliation.

Sintering, microstructure, thermal conductivity and microwave dielectric properties of xLiF-(1-x)MgO ceramics (x=0.03-0.10 mol) were investigated. The high density was obtained in the specimens of x≥0.06, i.e., 0.04 LiF-0.96 MgO in mol, whereas the amount of 0.03 mol LiF was insufficient to densify. From the result that the contact flattening in the sintered specimen was observed, the densification occurred through the liquid-phase sintering. The specimen of x=0.06 showed the highest room-temperature thermal conductivity. Relative density, thermal conductivity, dielectric constant, and quality factor (Q x f) of the specimen for x=0.06 sintered at 900°C for 4 h were 97.8%, 39.2 Wm-1K-1, 9.45, and 14,671 GHz, respectively.

The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was 7.6℃ higher while lowest temperature was 7.8℃ lower. The test on the heat sinks made by the materials, highest temperature was 4.1℃ higher and lowest temperature was 3.9℃ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.

Because of the development of LED technology, products due to high output and compact, thematerial with high thermal conductivity has been developed. Now that heat radiating part of the LEDlamp is currently used for die casting of aluminum. The development of aluminum with excellent thermalconductivity is required. In this study, we measured the thermal properties and compared them while weproduced the alloy by changing the component of die casting aluminum. From this study, the thermalconductivity and thermal resistance of the developed alloy were superior to die casting aluminum.

In this paper, the characteristics of a carbon nanotube composite heat sink proposed to replace the advanced Al heat sinks for LED lighting devices were studied. Proposed CMP-PLA heat sink was made by mixing 20∼70 wt% carbon nanotube, 20∼70 wt% bio-degradable polymer of melt-blended PLA (poly lactic acid) and PBS (poly butylene succinate) and PLA nucleating agents composed of the mixture of soybean oil and biotites, at 150∼220℃ with 1,000∼1,500 rpm. Optical and electric characteristics of 7.5W LED lighting devices using heat sinks with such prepared CMP-PLA were investigated. And, the properties of the heat, which was not released from the CMP-PLA type heat sinks, was also investigated. The color temperature of LED lighting devices using the CMP-PLA heat sinks was 5,956 K,which is x= 0.32 and y= 0.34 in the XY chromaticity, and the color rendering index was 75. The luminous flux and the luminous efficiency of LED lighting devices using the CMP-PLA heat sinks was 540.6 lm and 72.68 lm/W respectively. Measured initial temperature of the heat sinks was 27℃, and their temperature increased as time to be saturated at 52℃ after an hour.

In this study, we proposed CMP-PLAs to replace the Al heat sinks as heat sink materials, and investigated heat dissipation characteristics of the LED lighting devices using them. The crystallinity of the proposed CMP-PLA heat sinks decreased with increasing carbon nanotube contents in CMP-PLA. However, the thermal conductivity was improved with the increase of the carbon nanotube contents. The heat dissipation characteristics of the LED lighting devices using CMP-PLA heat sinks was improved with increasing carbon nanotube contents in CMP-PLA. For the LED lighting devices using CMP-PLA heat sinks with 40% carbon nanotube contents, the initial temperature measured at the heat sink plate was 27℃, which increased as time, and it was saturated around 56℃ after an hour. The LED lighting devices using CMP-PLA heat sinks are expected to be functional materials that can reduce their weight and improve their electric properties, compared to those using existing Al heat sinks.

In this paper, heat-releasing sheets made of AlN powder and acryl binder as thermoset were prepared using tape casting method. The crystal structure and morphology, the thermal properties as nonvolatile solid content and thermal conductivity, and the surface resistance of heat- releasing sheet were measured by using X-ray diffractometer, field emission-scanning electron microscopy, thermo gravimetric analyzer and laser flash instrument, and surface resistance meter. It was proved that thermal conductivity is greatly affected by the content of binder in heat-releasing sheet. Superior thermal conductivity above 3.5W/mK and suface resistance were obtained at heat-releasing sheet with above 90% of AlN powder.

In this paper, heat-releasing composite sheets made of AlN, graphite, Al powder and acryl binder as thermoset were prepared using tape casting method, The crystal structure, morphology, thermal conductivity of heat-releasing composite sheet were measured by using X-ray diffractometer, field emission-scanning electron microscopy and laser flash instrument. It was found thermal conductivity of sheet was decided by solid content, composition including AlN, graphite, Al in heat-releasing composite sheets. As a result, 4.56W/mK of thermal conductivity could be obtained by using LFA 447.