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"Thermocompression bonding"

Keywords

Thermal shock test (2)
Thermocompression bonding (2)
Anisothtopic (1)
Anisotropic conductive adhesive films (1)
Conductive film (1)

Publication year

2009 (2)

Authors

Young Eui Shin (2)
Il Jea Jo (1)
Jin Suk Pak (1)
Jin Suk Park (1)
Sun Eik Son (1)

Keywords

Thermal shock test (2)
Thermocompression bonding (2)
Anisothtopic (1)
Anisotropic conductive adhesive films (1)
Conductive film (1)
Conductive particle (1)
Fiat panel display (1)
Filp chip package (1)
Themosonic bonding (1)

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authors

Young Eui Shin (2)
Il Jea Jo (1)
Jin Suk Pak (1)
Jin Suk Park (1)
Sun Eik Son (1)

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Publication Year

2009 (2)

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"Thermocompression bonding"

A Study on Thermosonic Bonding Process and Its Reliability Evaluation of Joints: Young Eui Shin, Jin Suk Park, Sun Eik Son; J Korean Inst Electr Electron Mater Eng 2009;22(8):625-631. Published online August 1, 2009; DOI: https://doi.org/10.4313/JKEM.2009.22.8.625

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Thermocompression Anisothropic Conductive Films(ACFs) bonding for Flat Panel Displays(FPDs) Application: Jin Suk Pak, Il Jea Jo, Young Eui Shin; J Korean Inst Electr Electron Mater Eng 2009;22(3):199-204. Published online March 1, 2009; DOI: https://doi.org/10.4313/JKEM.2009.22.3.199

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