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반도체 / 슬러리와 패드변화에 따른 텅스텐 플러그 CMP 공정의 최적화

김상용, 서용진, 이우선, 이강현, 장의구

An Optimization of Tungsten Plug Chemical Mechanical Polishing ( CMP ) using the Different of Slurry and Pad

Sang Yong Kim, Yong Jin Seo, Woo Sun Lee, Kang Hyeon Lee, Eui Goo Chang
J Electr Electron Mater 2000;13(7):568-574.
Published online: July 1, 2000
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An Optimization of Tungsten Plug Chemical Mechanical Polishing ( CMP ) using the Different of Slurry and Pad
J Electr Electron Mater. 2000;13(7):568-574.   Published online July 1, 2000
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Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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An Optimization of Tungsten Plug Chemical Mechanical Polishing ( CMP ) using the Different of Slurry and Pad
J Electr Electron Mater. 2000;13(7):568-574.   Published online July 1, 2000
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