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구리 확산에 대한 Pt/Ti 및 Ni/Ti 확산 방지막 특성에 관한 연구

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A Study on the Diffusion Barrier Properties of Pt/Ti and Ni/Ti for Cu Metallization

Sung Keun Chang
J Electr Electron Mater 2003;16(2):97-101.
Published online: February 1, 2003
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A Study on the Diffusion Barrier Properties of Pt/Ti and Ni/Ti for Cu Metallization
J Electr Electron Mater. 2003;16(2):97-101.   Published online February 1, 2003
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
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A Study on the Diffusion Barrier Properties of Pt/Ti and Ni/Ti for Cu Metallization
J Electr Electron Mater. 2003;16(2):97-101.   Published online February 1, 2003
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