Wafer Level Packaging of RF-MEMS Devices with Vertical Feed-through

Yong Gug Kim; Yun Gwon Park; Jae Gyeong Kim; Byeong Gwon Ju

Articles

Page Path

Ultra Thin 실리콘 웨이퍼를 이용한 RF-MEMS 소자의 웨이퍼 레벨 패키징

김용국, 박윤권, 김재경, 주병권

Wafer Level Packaging of RF-MEMS Devices with Vertical Feed-through

Yong Gug Kim, Yun Gwon Park, Jae Gyeong Kim, Byeong Gwon Ju

J Electr Electron Mater 2003;16(12s):1237-1241.

6 Views
0 Download
0 Crossref
0 Scopus

prev next

Full Article

Download PDF

Keywords: Thin wafer, RF-MEMS, Vertical feed-through, Package

Cite

CITE

export

Copy Download

Format

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

RIS — For EndNote, ProCite, RefWorks, and most other reference management software
BibTeX — For JabRef, BibDesk, and other BibTeX-specific software

Include:

Citation for the content below
Citation and abstract for the content below

Wafer Level Packaging of RF-MEMS Devices with Vertical Feed-through

J Electr Electron Mater. 2003;16(12s):1237-1241.

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

RIS — For EndNote, ProCite, RefWorks, and most other reference management software
bib — For JabRef, BibDesk, and other BibTeX-specific software

Include:

Citation for the content below
Citation and abstract for the content below

Wafer Level Packaging of RF-MEMS Devices with Vertical Feed-through

J Electr Electron Mater. 2003;16(12s):1237-1241.

Articles

Page Path

Ultra Thin 실리콘 웨이퍼를 이용한 RF-MEMS 소자의 웨이퍼 레벨 패키징

Wafer Level Packaging of RF-MEMS Devices with Vertical Feed-through

Full Article

CITE

Download Citation

Format:

Include:

ABOUT

BROWSE ARTICLES

EDITORIAL POLICIES

FOR CONTRIBUTORS