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구리 CMP 적용을 위한 산성 콜로이드 실리카를 포함한 준무연마제 슬러리 연구

김남훈, 김상용, 서용진, 김태형, 장의구

A Study on Semi Abrasive Free Slurry including Acid Colloidal Silica for Copper Chemical Mechanical Planarization

Nam Hun Kim, Sang Yong Kim, Yong Jin Seo, Tae Hyeong Kim, Ui Gu Jang
J Electr Electron Mater 2004;17(3):272-277.
Published online: March 1, 2004
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A Study on Semi Abrasive Free Slurry including Acid Colloidal Silica for Copper Chemical Mechanical Planarization
J Electr Electron Mater. 2004;17(3):272-277.   Published online March 1, 2004
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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A Study on Semi Abrasive Free Slurry including Acid Colloidal Silica for Copper Chemical Mechanical Planarization
J Electr Electron Mater. 2004;17(3):272-277.   Published online March 1, 2004
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