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Solder Paste로 접합된 비아볼의 Ball-off에 관한 연구

김경수, 김진영

A Study on the Ball-off of Via Balls Bonded by Solder Paste

Kyoung Su Kim, Jin Young Kim
J Electr Electron Mater 2004;17(6):575-579.
Published online: June 1, 2004
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A Study on the Ball-off of Via Balls Bonded by Solder Paste
J Electr Electron Mater. 2004;17(6):575-579.   Published online June 1, 2004
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
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A Study on the Ball-off of Via Balls Bonded by Solder Paste
J Electr Electron Mater. 2004;17(6):575-579.   Published online June 1, 2004
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